Wednesday, October 03, 2007

Design-for-Test In the News

A smattering of press releases and such for the last couple of months:

Westinghouse Rail Systems selects XJTAG boundary scan system to verify prototype integrity

Mentor Graphics Chairman and CEO to Present Keynote at International System-on-Chip Design Conference

Mentor's TestKompress reaches out to 45-nm

Mentor Graphics Announces TestKompress Xpress Technology to Address Manufacturing Test Requirements for 65 and 45 Nanometer Integrated Circuits

LogicVision Announces That Q3 2007 Cash Exceeds Guidance

Goepel’s Puri on North American restructuring

Dr. Jacob Abraham receives Best Paper Award at international conference

Global Unichip Adopts Synopsys Test Solution to Achieve Higher SoC Test Quality

Strategic Alliance Between GOEPEL Electronic And Testonica Lab

LogicVision Provides Desktop Silicon Characterization and Diagnostics Solution with the Introduction of Silicon Insight

Perform Design-for-Test and Power Management at the RTL

New Digital I/O Scan Test Module Provides Flexibility

International Test Conference -- The Cornerstone of Test Week(TM) Holds 38th Conference in Santa Clara, California, October 23-25, 2007

ITC tackles nanometer test challenges

Synopsys Lowers the Cost of Semiconductor Testing at Tessolve

Cost-Effective, Ultra-High-Quality Test Results Using Synopsys DFT MAX Achieved at SHARP

ARM Selects XJTAG For RealView Development Tools Debug And Test

LogicVision Announces New Release of Its Embedded SerDes Test Solution

SynTest granted 6 more Patents since October 2006